Texas Instruments
Texas Instruments
Posted 19 days ago
Full Time
Santa Clara, California
In Person
Smart Summary
Responsibilities
The packaging engineer will design and develop semiconductor packaging technologies while collaborating with cross-functional teams to ensure product reliability and yield. They will also conduct electrical, mechanical, and thermal modeling to optimize package performance and prevent high-risk design issues.
Qualifications
You have a PhD in Material Science, Mechanical Engineering, Chemical Engineering, Physics, or Electrical Engineering with a GPA of 3.0/4.0 or higher. You should also have coursework or research experience in semiconductor packaging/fabrication and strong fundamentals in heat transfer, thermodynamics, and stress analysis.
Must Have Skills for ATS
semiconductor packaging
AutoCAD
FEM modeling
heat transfer
thermodynamics
stress analysis
MEMS
3D integration
CVD
PVD
thin film deposition
electroplating
plasma etch
ML based package design
wafer bumping
optical packaging
plating
adhesion
surface treatment
X-ray Inspection
materials characterization
FA techniques
Job Description
Change the world. Love your job.
In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI, and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job. The TMG Development program is a 12-month program for new college graduates in the TMG organization.
Interface across various work areas and organizations to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power. In this role you'll get the opportunity to thrive in a fast paced, dynamic environment where high-energy, prioritization skills and adaptability are a must!
Packaging engineers play an important role at TI which encompasses the following responsibilities:
As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry's top engineering minds at your disposal. TI's corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy.
Put your talent to work with us as a Packaging engineer !
Minimum Requirements:
Preferred Qualifications:
Texas Instruments
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