Engineering Student Internship (IR&D)

3

3D Glass Solutions, Inc-

Posted 4 months ago

Internship

Albuquerque, New Mexico

In Person

Smart Summary

Responsibilities

The intern will work on special projects involving electronic packaging and microfabrication while following safety procedures. Responsibilities include performing engineering-centric tasks across various stages of the manufacturing process.

Qualifications

You are currently pursuing an engineering degree and have completed at least four semesters. You possess strong verbal and written communication skills and demonstrate a willingness to adapt to changing environments. The ability to work collaboratively and understand data management is also important for this role.

Must Have Skills for ATS

electronic packaging

advanced microfabrication

data analysis

Job Description

Job/Position Summary

As a Student Intern you will work on special projects which align with your course objectives and studies. The goals of 3DGS’ internship program is to provide mentorship to undergraduate and graduate students in the area of electronic packaging, advanced microfabrication, data analysis, and problem solving.  This position is typically 20 hours or more a week. Internships are typically three months and can occur at any time throughout the year, depending upon the student’s educational schedule.

Primary Responsibilities

  • Follow all safety procedures and guidelines.
  • Perform various engineering-centric tasks at various locations throughout the manufacturing process
  • Perform additional functions and other duties as assigned or required. 

Requirements

  • Currently registered in an Engineering Program
  • Completed at least four semesters
  • This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements. Requirements include US Citizenship, US Permanent Resident, or the ability to meet contract-specific licensure requirements.

Physical/Working Requirements

  • Must be able to wear personal protective gear most of the day (where applicable)
  • Prolonged periods of sitting or standing

Behavioral Traits

  • Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
  • A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
  • The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.

As an Intern, you will not be entitled to Company benefits (Health, Dental, Vision, IRA). Interns who work 30 hours or more per week are eligible to receive 1 hour of sick leave (2 hours per pay period), per the New Mexico Sick Leave Law.

3

3D Glass Solutions, Inc-

3D Glass Solutions, Inc. (3DGS) is a private late-stage high-tech manufacturing business headquartered in Albuquerque, New Mexico.  3DGS’ main operations are focused on the fabrication of electronic system and devices using photo-definable glass-ceramics.  3DGS manufactures a wide variety of glass-based system-in-package (SiP) devices and components using its patented low-loss photosensitive APEX® Glass technology for applications in radio-frequency (RF) electronics, photonics, automotive radar, integrated circuit (IC) electronics, medical, aerospace, defense, wireless infrastructure, mobile handset, and Internet of Things (IOT) industries.  3DGS has created foundational patent positions related to all photo-sensitive glass-ceramic materials and devices.  3DGS owns the fundamental intellectual property (IP) for all four positions (materials, design, systems, & manufacturing) related to glass-ceramic devices for the electronics packaging industry.  3DGS leverages its unique product solutions providing device manufacturing and systems integration services for a number of standard and custom products.  We provide our customers complete glass-enabled systems integration services.  Our aim is to provide our customers with an integrative solution in RF electronics and IC packaging that allows them to integrate more components onto a single platform while decreasing overall manufacturing costs. 
Runway Icon
Boost Your Interview Chances

With Runway

See Your Fit for This Role

1-5 min

Your Score

?

Top Applicants

90%

Your Job Search Advantage

Key Gaps & Next Steps:

Address these in your resume & Interview

Top Strengths For This Role

Highlight these in your cover letter & interview

Your Interview Guide

A Personalized Interview Strategy

Freshest Opportunities

Never Miss a Good Fit

Get notified when jobs mach your criteria