Role Description:

Assist FA engineers in performing failure analysis on customer’s RMA returns and internal engineering requests
Learn and perform hands-on in electrical fault isolation and defect characterization at both IC (or silicon level) and power supply

Inspect and document incoming RMA returns both at IC’s and Power Supply levels
Support electrical debugging activities, including performing impedance measurements, ATE test, and curve tracing of IC’s

Work with senior engineers to analyze test data and perform physical analysis (e.g., optical microscopy and CSAM/SEM imaging)
Support FA engineers in data collection, documentation and contribution to technical reports

Expected Learning Outcomes:

Gain hands-on experience in semiconductor failure analysis workflows
Develop understanding of electrical fault isolation and physical analysis techniques
Learn to interpret I-V curve and ATE test datalogs
Build practical knowledge of FA tools such as XRAY, CSAM, probing systems, SEM/FIB
Learn technical reporting and communication skills
Develop collaboration experience in engineering environments

Deliverables:

Document failure analysis findings with observations and preliminary conclusions
Data summaries and failure trend insights
Contributions to root cause analysis under engineer supervision
Presentations summarizing internship work or failure case studies

Qualifications & RequirementsRequired Skills:

Fundamental knowledge of analog and digital circuits
Basic understanding of semiconductor device physics and IC fabrication processes
Exposure to lab tools such as curve tracer, Oscilloscopes, Source meters, and DMM
Basic technical report writing and documentation skills

Preferred Skills:

Completed academic projects that required using S/W tools such as Cadence/Synopsis, MATLAB, Spice etc.. to design, simulate, assemble, and test the design at final products
Hands-on lab or academic project experiences in device/PCB level characterization
Familiarity with IC/PCB-level schematics and layout
Understanding of analog, mixed-signal, or power IC operation
Exposure to some failure analysis techniques such as optical micro-scopes, XRAY, and SEM

Education Level: 3rd year Bachelors or Masters DegreeField(s) of Study: Electrical/Electronics Engineering, Power Electronics Engineering Power Integrations is committed to building teams that drive innovation and therefore review a range of factors when determining compensation. The hourly pay range for this internship is $32 to $34. Our pay ranges are determined by role, level, qualifications and work location. The range displayed on the job posting reflects the minimum and maximum target for this intern in California. Within the range, individual pay is determined by additional factors, including job-related skills, experience, and relevant education or training.

Power Integrations, Inc., is a Silicon Valley-based supplier of high-performance electronic components used in high-voltage power-conversion systems. Our integrated circuits and diodes enable compact, energy-efficient AC-DC power supplies for a vast range of electronic products including mobile devices, TVs, PCs, appliances, smart utility meters and LED lights. Our SCALE™ IGBT drivers enhance the efficiency, reliability and cost of high-power applications such as industrial motor drives, solar and wind energy systems, electric vehicles and high-voltage DC transmission. Since its introduction in 1998, Power Integrations' EcoSmart® energy-efficiency technology has prevented billions of dollars' worth of energy waste and millions of tons of carbon emissions. Reflecting the environmental benefits of our products, Power Integrations' stock is a member of clean-technology stock indices sponsored by Cleantech Group LLC and Clean Edge. Visit our Green Room for a comprehensive guide to energy-efficiency standards around the world. For more information please visit www.power.com.

Failure Analysis Intern

Failure Analysis Intern

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