Summer 2026 - AI Hardware Research Intern: 3D Generative AI Accelerator Design (7269)

TSMC

Applications Closed

Posted 4 months ago

Internship

San Jose, California

In Person

Smart Summary

The intern will design an edge accelerator for Generative AI and evaluate various memory options and 3D array design options. They will also benchmark energy and latency for the considered technology options.

We are seeking a Ph.D. student in Electrical Engineering or Computer Science for a Summer 2026 AI Hardware Research Internship. The ideal candidate will have experience with RTL design, embedded DRAM options, 3D memory array evaluations, generative AI workloads, and accelerator latency and energy evaluations. This internship focuses on designing an edge accelerator for GenAI and evaluating its PPA by RTL at N7.

Must Have Skills for ATS

RTL Design

Embedded DRAM

3D Memory Array Evaluations

Generative AI Workloads

Accelerator Latency Evaluations

Energy Evaluations

Job Description

Overview of Role

  • Design an edge accelerator for GenAI, based on https://dl.acm.org/doi/full/10.1145/3768168
  • Evaluate PPA by RTL at N7 for all necessary building blocks
  • Evaluate and benchmark different memory options, including various eDRAM and eNVM
    • In case of eDRAM, quantify the refresh overhead for various options
  • Evaluate various 3D array design options by considering the integration scheme (bonding, monolithic, hybrid) and granularity of 3D connections
    • Evaluate the benefits of 3D interconnect pitch scaling
  • Analyze the viability of the low-power memory access schemes at extreme bandwidth proposed in the reference and offer solutions tailored for specific memory devices and arrays
  • Quantify the differences between the new design and the analytical estimation in the reference
  • Include workload-level energy and latency benchmarks for the considered technology options 
  • Show the pathway for upscaling to larger workloads either by larger monolithic dies or 2.5D chiplet integration

Minimum Qualifications

  • Ph.D. Student in Electrical Engineering or Computer Science

Experience on: 

  • RTL design
  • Embedded DRAM options
  • 3D memory array evaluations
  • Generative AI workloads
  • Accelerator latency and energy evaluations

Preferred Qualifications

  • Embedded NVM options and evaluations 

Company Description

As a trusted technology and capacity provider, TSMC is driven by the desire to be:

  1. The world’s leading dedicated semiconductor foundry
  2. The technology leader with a strong reputation for manufacturing excellence
  3. Advancing semiconductor manufacturing innovations to enable the future of technology

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and a portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

In North America, TSMC has a strong sales and service organization that works with customers by helping them achieve silicon success with cutting-edge technologies and manufacturing excellence. The Company has continued to accelerate its R&D investment and staffing in recent years and is expanding its manufacturing footprint to support customer innovation with 3D IC technologies and optimal manufacturing capacity.

Diversity statement

TSMC Technology, Inc. is committed to employing a diverse workforce and provides Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, or any other characteristic protected by applicable law.

TSMC is an equal opportunity employer prizing diversity and inclusion. We are committed to treating all employees and applicants for employment with respect and dignity. If you require reasonable accommodation due to a disability during the application or the recruiting process, please feel free to notify us at G_ACCOMMODATIONS@TSMC.COM. TSMC confirms to all applicants its commitment to meet TSMC’s obligations under applicable employment law. Reasonable accommodations will be determined on a case-by-case basis. 

Pay Transparency Statement

At the time of this posting, this role typically pays an hourly rate between $42 and $48 per hour. The range displayed reflects the minimum and maximum target for new hires. Actual pay may be more or less than the posted range. Factors that influence pay include the individual's skills, qualifications, education, experience and the position level and location.

TSMC

Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore"​ wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE® design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality. The company's total managed capacity reached above 9 million 12-inch equivalent wafers in 2015. TSMC operates three advanced 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). TSMC also manages two eight-inch fabs at wholly owned subsidiaries: WaferTech in the United States and TSMC China Company Limited. TSMC also obtains eight-inch wafer capacity from other companies in which the Company has an equity interest. TSMC is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares trade on the New York Stock Exchange (NYSE) under the symbol "TSM"​.

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