About the Company:

At SK Hynix Memory Solution, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to data centers. As a global leader in DRAM and NAND flash technologies, we drive the evolution of advancing mobile technology, empowering cloud computing, and pioneering future technologies. Our cutting-edge memory technologies are essential in today's most advanced electronic devices and IT infrastructure, enabling enhanced performance and user experiences across the digital landscape.

We're looking for innovative minds to join our mission of shaping the future of technology. At SK Hynix Memory, you'll be part of a team that's pioneering breakthrough memory solutions while maintaining a strong commitment to sustainability. We're not just adapting to technological change – we're driving it, with significant investments in artificial intelligence, machine learning, and eco-friendly solutions and operational practices. As we continue to expand our market presence and push the boundaries of what's possible in semiconductor technology, we invite you to be part of our journey to creating the next generation of memory solutions that will define the future of computing.

Position Summary:

We are offering an exciting opportunity at SK Hynix Memory Solutions America for a Signal Integrity Hardware Intern Engineer to join our dynamic engineering team. In this position, you will work on advanced SSD development projects, gaining hands-on experience in 3D modeling and high-speed digital system analysis of advanced PCB. You will be introduced to the basics of the advanced PCB design and manufacturing process flow. This is a very exciting opportunity for a candidate aspiring to build up professional growth and be part of SK Hynix success.

Responsibilities:

• Become familiar with system design and the process steps involved in making the end product.
• Learn the basics of using numerical analysis tools such as ANSYS AEDT(HFSS, Q3D) etc.
• Learn the basics of using numerical analysis tools such as ADS, HSPICE etc.
• Start developing board-level electrical Finite Element Analysis (FEA) Models to characterize S-parameters and RLC in the PCB.
• Conduct signal and power integrity simulations across the entire product lifecycle, from feasibility and pre-layout to post-layout and validation.
• Learn to design and layout guidelines for IC packages and PCBs to ensure signal and power integrity.
• Document all simulation models, codes, and scripts and present the results in simple and clear terms to a broader audience.

Qualifications:

• Currently pursuing a Bachelor's or Master's degree in Electrical Engineering or a related field.
• Strong interest in transmission line theory, electromagnetic concepts and its applications in PCB development.
• Strong interest in signal integrity, power integrity fundamentals and its applications in SSD systems.
• Strong problem-solving and analytical skills.
• Excellent communication and teamwork abilities, with a desire to collaborate effectively in a multidisciplinary environment.

Preferred Skills

• Currently pursuing a Bachelor's or Master’s degree in Electrical Engineering or a related field.
• Familiarity with SIPI simulation tools such as Ansys AEDT (HFSS, Q3D), Cadence Allegro and Sigrity, ADS, and HSPICE.
• Basic understanding of pcb stackup concepts and materials is advantageous.
• Familiar with lab equipments such as oscilloscope, TDR, high speed probing and able to read schematic.
• Familiar with Microsoft offices and script languages.

COMPENSATION: $35/hr - $45/hr

REGARDING COMPENSATION:

The salary offered to a selected candidate will be tailored based on several factors, including the location, job grade, relevant knowledge, skills, and experience. We also take into account the internal equity among our current team members to ensure fairness and competitiveness